发表论文
[1] Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Synthesis of Cu Nanowires by Template Electrodeposition and Their Application in Pressure Sensors. JOURNAL OF ELECTRONIC MATERIALS. 2023, http://dx.doi.org/10.1007/s11664-023-10317-w.[2] 谌可馨, 高丽茵, 许增光, 李哲, 刘志权. 先进封装中硅通孔(TSV)铜互连电镀研究进展. 科技导报[J]. 2023, 41(5): 15-26, http://sciencechina.cn/gw.jsp?action=detail.jsp&internal_id=7429816&detailType=1.[3] Huang, Jing, Gao, LiYin, Peng, ZhenJia, Li, Zhe, Liu, ZhiQuan, Sun, Rong. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL). NANOTECHNOLOGY[J]. 2023, 34(1): [4] 张明辉, 高丽茵, 刘志权, 董伟, 赵宁. 先进封装铜-铜直接键合技术的研究进展. 电子与封装[J]. 2023, 58-68, https://kns.cnki.net/kcms2/article/abstract?v=M9N_p6ifsvPwHQJCh9nZFzdsu1whRcikBXDHMrIv0KHl8mJVabCcAL6ZrViZpMNcLpNvmMGwHOB2dL9LWBNAeGKDJvoRw4y7cHDMPbZUc_FMRRJeU4vYiPb7r0E1OZK-&uniplatform=NZKPT&language=gb.[5] Li, Qihai, Zhao, Wei, Zhang, Wei, Chen, Weiwei, Liu, Zhiquan. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution. INTERNATIONAL JOURNAL OF FATIGUE[J]. 2023, 167: http://dx.doi.org/10.1016/j.ijfatigue.2022.107356.[6] Chen YinBo, Gao ZhaoQing, Liu ZhiQuan. Temperature gradient induced orientation change of Bi grains in Sn-Bi57-Ag0.7 solder joint. Acta Metall. Sin.-Eng. Lett.[J]. 2022, [7] Luo RD, Yu XL, Wu Z, Zhang H, Liu ZhiQuan, Katsuaki Suganuma, Li CaiFu. Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment. Materials Letters: X[J]. 2022, 13: 100124-, [8] Chen Yinbo, Wang Changchang, Gao Yue, Gao Zhaoqing, Liu ZhiQuan. Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling. J. Mater. Sci.: Mater. Electron.[J]. 2022, 33(4): 1942-1952, [9] Li-Yin Gao, Liu, Zhi-Quan. Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor. IEEE Transactions on Magnetics[J]. 2022, [10] Zhou, Shiqi, Zhang, YuBo, Gao, LiYin, Li, Zhe, Liu, ZhiQuan. The self-healing of Kirkendall voids on the interface between Sn and (111) oriented nanotwinned Cu under thermal aging. APPLIED SURFACE SCIENCE[J]. 2022, 588: [11] 高丽茵, 李财富, 刘志权, 孙蓉. 先进电子封装中焊点可靠性的研究进展. 机械工程学报[J]. 2022, [12] Guo Rumeng, Xiao Yubo, Gao Yue, Zhou Shiqi, Liu ZhiQuan. Interfacial enhancement of Ag and Cu particles sintering using <111>-oriented nanotwinned Cu as substrate for die-attachment. China Welding[J]. 2022, 31(1): 22-28, [13] Gao, Yue, Xiao, Yubo, Liu, ZhiQuan, Liu, Yang, Sun, Rong. Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors. JOURNALOFMATERIALSSCIENCEMATERIALSINELECTRONICS[J]. 2022, 33(7): 3576-3585, http://dx.doi.org/10.1007/s10854-021-07551-5.[14] Gao, Yue, Jiu, Jinting, Chen, Chuantong, Suganuma, Katsuaki, Sun, Rong, Liu, ZhiQuan. Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGYnull. 2022, 115(20): 251-255, http://dx.doi.org/10.1016/j.jmst.2021.10.047.[15] Yu-Bo Zhang, Li-Yin Gao, Xiao Li, Zhe Li, 马旭梁, Liu, Zhi-Quan, Rong Sun. Electroplating nanotwinned copper for ultra-fine pitch redistribution layer(RDL) of advanced packaging technology. 2021 International Conference on Electronic Packaging Technology (ICEPT2021)null. 2021, [16] Gao, LiYin, Luo, YiXiu, Wan, Peng, Liu, ZhiQuan. Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints. MATERIALS CHARACTERIZATION[J]. 2021, 178: http://dx.doi.org/10.1016/j.matchar.2021.111195.[17] 黄静, 李忠国, 高丽茵, 李晓, 李哲, 刘志权, 孙蓉. 亚甲基蓝对直流电镀纳米孪晶铜组织及力学性能的影响. 集成技术[J]. 2021, 10(1): 55-62, http://lib.cqvip.com/Qikan/Article/Detail?id=7103981244.[18] Chen, Yinbo, Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints. JOURNALOFMATERIALSSCIENCEMATERIALSINELECTRONICS[J]. 2021, 32(2): 2172-2186, https://www.webofscience.com/wos/woscc/full-record/WOS:000604092100027.[19] Gao, LiYin, Wan, Peng, Liu, ZhiQuan. Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 498: http://dx.doi.org/10.1016/j.jmmm.2019.166131.[20] Meng, ZhiChao, Gao, LiYin, Liu, ZhiQuan. Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder. MATERIALS CHARACTERIZATION[J]. 2020, 163: http://dx.doi.org/10.1016/j.matchar.2020.110278.[21] 高丽茵, 李财富, 曹丽华, 刘志权. 热电耦合作用下功率器件引脚开裂的机理. 科学通报[J]. 2020, 65(20): 2169-2177, http://lib.cqvip.com/Qikan/Article/Detail?id=7102508376.[22] Gao, LiYin, Wen, Jian, Li, CaiFu, Chen, Chunhuan, Liu, ZhiQuan. The effect of finish layer on the interfacial cracking failure of Au-Si bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 115: https://www.webofscience.com/wos/woscc/full-record/WOS:000554882700004.[23] Robertson, Stuart, Doak, Scott, Sun, FuLong, Liu, ZhiQuan, Liu, Changqing, Zhou, Zhaoxia. Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters. JOURNAL OF MICROSCOPY[J]. 2020, 279(3): 212-216, https://www.webofscience.com/wos/woscc/full-record/WOS:000560435100011.[24] Yang, LinLin, Chen, Chunhuan, Yuan, Jie, Gao, LiYin, Shang, Zhengang, Liu, ZhiQuan. Effect of applied magnetic field on the electroplating and magnetic properties of amorphous FeNiPGd thin film. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS[J]. 2020, 495: http://dx.doi.org/10.1016/j.jmmm.2019.165872.[25] Tian, Feifei, Pang, Xueyong, Xu, Bo, Liu, ZhiQuan. Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging. JOURNAL OF ELECTRONIC MATERIALS[J]. 2020, 49(4): 2651-2659, https://www.webofscience.com/wos/woscc/full-record/WOS:000505344800016.[26] 姜霖, 张亮, 刘志权. Al中间层和Ni(V)过渡层对Co/Al/Cu三明治结构靶材背板组件焊接残余应力的影响. 金属学报[J]. 2020, 56(10): 1433-1440, http://lib.cqvip.com/Qikan/Article/Detail?id=7103074124.[27] Jiang Lin, Zhang Liang, Liu Zhiquan. Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly. ACTA METALLURGICA SINICA[J]. 2020, 56(10): 1433-1440, https://www.webofscience.com/wos/woscc/full-record/WOS:000571986900013.[28] Wang, Changchang, Chen, Yinbo, Liu, ZhiQuan. Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging. ACTA METALLURGICA SINICA-ENGLISH LETTERS[J]. 2020, 33(10): 1388-1396, http://lib.cqvip.com/Qikan/Article/Detail?id=7103099400.[29] Du, Yahong, Gao, LiYin, Yu, Daquan, Liu, ZhiQuan. Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 31(4): 2967-2975, https://www.webofscience.com/wos/woscc/full-record/WOS:000514597300023.[30] Gao, LiYin, Cui, XianWei, Tian, FeiFei, Liu, ZhiQuan. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure. JOURNAL OF ELECTRONIC MATERIALS[J]. 2020, 49(10): 6223-6231, https://www.webofscience.com/wos/woscc/full-record/WOS:000559506500003.[31] Chen, Chuantong, Gao, Yue, Liu, ZhiQuan, Suganuma, Katsuaki. 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste. SCRIPTA MATERIALIA[J]. 2020, 179: 36-39, http://dx.doi.org/10.1016/j.scriptamat.2019.12.040.[32] LiYin Gao, Jian Wen, CaiFu Li, Chunhuan Chen, ZhiQuan Liu. The effect of finish layer on the interfacial cracking failure of AusbndSi bonding. ENGINEERING FAILURE ANALYSIS[J]. 2020, 115: http://dx.doi.org/10.1016/j.engfailanal.2020.104682.[33] Meng, Zhichao, Wen, Ming, Liu, ZhiQuan, IEEE. Interfacial microstructure of NiPt/SnIn/Cu sputtering target assembly after soldering. 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)[J]. 2020, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000629072600020.[34] Liu, ZhiQuan, Meng, ZhiChao, Wu, Di, Shang, Zhengang, He, Xin, Xiong, Xiaodong. The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering. MICROELECTRONICS RELIABILITY[J]. 2020, 113: http://dx.doi.org/10.1016/j.microrel.2020.113906.[35] Zhang, Liang, Liu, Zhiquan. Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6 mu m). JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2020, 31(3): 2466-2480, https://www.webofscience.com/wos/woscc/full-record/WOS:000505378900009.[36] Yuan, Jie, Qian, Xitang, Meng, Zhichao, Yang, Bo, Liu, ZhiQuan. Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation. ACS APPLIED MATERIALS & INTERFACES[J]. 2019, 11(19): 17915-17924, https://www.webofscience.com/wos/woscc/full-record/WOS:000468364500087.[37] Jiang, Nan, Zhang, Liang, Liu, ZhiQuan, Sun, Lei, Long, WeiMin, He, Peng, Xiong, MingYue, Zhao, Meng. Reliability issues of lead-free solder joints in electronic devices. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS[J]. 2019, 20(1): 876-901, https://doaj.org/article/67223ea7164e4f1e83a427074f4399fd.[38] Li, CaiFu, Li, Wanli, Zhang, Hao, Liu, Jinting, Yang, Yang, Li, Lingying, Gao, Yue, Liu, ZhiQuan, Suganuma, Katsuaki. Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics. ACS APPLIED MATERIALS & INTERFACES[J]. 2019, 11(3): 3231-3240, http://dx.doi.org/10.1021/acsami.8b19069.[39] Zhao, Meng, Zhang, Liang, Liu, Zhiquan, Xiong, Mingyue, Sun, Lei, Jiang, Nan, Xu, Kaikai. Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 30(16): 15054-15063, http://dx.doi.org/10.1007/s10854-019-01878-w.[40] 曹丽华, 陈胤伯, 史起源, 远杰, 刘志权. 合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响. 金属学报[J]. 2019, 55(12): 1606-1614, http://lib.cqvip.com/Qikan/Article/Detail?id=7100512058.[41] Du, Yahong, Wen, Ming, Ji, Hongjun, Li, Mingyu, Liu, ZhiQuan. Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 30(14): 12840-12850, https://www.webofscience.com/wos/woscc/full-record/WOS:000476518000002.[42] Zhao, Meng, Zhang, Liang, Liu, ZhiQuan, Xiong, MingYue, Sun, Lei. Structure and properties of Sn-Cu lead-free solders in electronics packaging. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS[J]. 2019, 20(1): 421-444, https://doaj.org/article/49b2e7c58c3244c0983f1912552d4cf3.[43] Cao Lihua, Chen Yinbo, Shi Qiyuan, Yuan Jie, Liu Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder. ACTAMETALLURGICASINICA[J]. 2019, 55(12): 1606-1614, [44] Li, Qihai, Li, CaiFu, Zhang, Wei, Chen, Weiwei, Liu, ZhiQua. Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling. MICROELECTRONICS RELIABILITY[J]. 2019, 99: 12-18, http://dx.doi.org/10.1016/j.microrel.2019.05.015.[45] Jiang, Nan, Zhang, Liang, Liu, Zhiquan, Sun, Lei, Xiong, Mingyue, Zhao, Meng, Xu, Kaikai. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2019, 30(19): 17583-17590, https://www.webofscience.com/wos/woscc/full-record/WOS:000490120000006.[46] Jiang, Lin, Zhang, Liang, Liu, ZhiQuan. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method. ACTA METALLURGICA SINICA-ENGLISH LETTERS[J]. 2019, 32(11): 1407-1414, http://lib.cqvip.com/Qikan/Article/Detail?id=7100378578.[47] Yuan, Jie, Li, CaiFu, Yang, Bo, Liu, ZhiQuan. The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles. MATERIALS CHARACTERIZATION[J]. 2018, 136: 94-99, http://dx.doi.org/10.1016/j.matchar.2017.12.008.[48] Du, Yahong, Liu, ZhiQuan, Ji, Hongjun, Li, Mingyu, Wen, Ming. The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2018, 29(16): 13774-13781, https://www.webofscience.com/wos/woscc/full-record/WOS:000439338500038.[49] Shi, QiYuan, Liu, ZhiQuan, Wu, Di, Zhang, Hao, Ni, DingRui, Suganuma, Katsuaki. Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2018, 29(10): 8371-8379, https://www.webofscience.com/wos/woscc/full-record/WOS:000430496800048.[50] Wang, Jing, Chen, Guang, Sun, Fulong, Zhou, Zhaoxia, Liu, ZhiQuan, Liu, Changqing. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing. CORROSION SCIENCE[J]. 2018, 139: 383-394, http://dx.doi.org/10.1016/j.corsci.2018.05.020.[51] Sun, FuLong, Gao, LiYin, Liu, ZhiQuan, Zhang, Hao, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2018, 34(10): 1885-1890, http://lib.cqvip.com/Qikan/Article/Detail?id=676492637.[52] Gao, LiYin, Li, CaiFu, Wan, Peng, Zhang, Hao, Liu, ZhiQuan. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2018, 739: 632-642, http://dx.doi.org/10.1016/j.jallcom.2017.12.328.[53] Gao, LiYin, Zhang, Hao, Li, CaiFu, Guo, Jingdong, Liu, ZhiQuan. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2018, 34(8): 1305-1314, http://lib.cqvip.com/Qikan/Article/Detail?id=676143476.[54] Tian, Feifei, Li, CaiFu, Zhou, Ming, Liu, ZhiQuan. The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2018, 740: 500-509, http://dx.doi.org/10.1016/j.jallcom.2017.12.355.[55] Sun, FuLong, Liu, ZhiQuan, Li, CaiFu, Zhu, QingSheng, Zhang, Hao, Suganuma, Katsuaki. Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via. MATERIALS[J]. 2018, 11(2): https://doaj.org/article/721fec7ffc4c43d3b8ac75bc9e299a46.[56] Yuan, Jie, Li, CaiFu, Liu, ZhiQuan, Di Wu, Cao, Lihua. Synthesis of variously shaped magnetic FeCo nanoparticles and the growth mechanism of FeCo nanocubes. CRYSTENGCOMM[J]. 2017, 19(43): 6506-6515, https://www.webofscience.com/wos/woscc/full-record/WOS:000414494700013.[57] Sun FuLong, Gao LiYin, Liu ZhiQuan, IEEE. Electrodeposition of nanotwinned copper film as under bump metallization. 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)null. 2017, 456-459, http://apps.webofknowledge.com/CitedFullRecord.do?product=UA&colName=WOS&SID=5CCFccWmJJRAuMzNPjj&search_mode=CitedFullRecord&isickref=WOS:000431392000100.[58] Gao, LiYin, Liu, ZhiQuan, Li, CaiFu. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling. JOURNAL OF ELECTRONIC MATERIALS[J]. 2017, 46(8): 5338-5348, http://ir.imr.ac.cn/handle/321006/78030.[59] Gao, LiYin, Li, CaiFu, Wan, Peng, Liu, ZhiQuan. A superior interfacial reliability of Fe-Ni UBM during high temperature storage. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS[J]. 2017, 28(12): 8537-8545, http://ir.imr.ac.cn/handle/321006/78112.[60] Shuang Gao, ZhiQuan Liu, CaiFu Li, Yizhou Zhou, Tao Jin. In situ TEM investigation on the precipitation behavior of μ phase in Ni-base single crystal superalloys. ACTA MATERIALIA. 2016, 110: 268-275, [61] Gao, Shuang, Zhou, Yizhou, Li, CaiFu, Liu, ZhiQuan, Jin, Tao. Effects of platinum group metals addition on the precipitation of topologically close-packed phase in Ni-base single crystal superalloys. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2016, 671: 458-464, http://dx.doi.org/10.1016/j.jallcom.2016.02.122.[62] Xiao, Yong, Li, Mingyu, Wang, Ling, Huang, Shangyu, Du, Xueming, Liu, Zhiquan. Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn-Al/Cu joints. MATERIALS & DESIGN[J]. 2015, 73: 42-49, https://www.webofscience.com/wos/woscc/full-record/WOS:000351278200006.[63] Zhang, Z H, Cao, H J, Li, M Y, Wang, Y, Liu, Z Q. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing. JOURNAL OF APPLIED PHYSICS[J]. 2014, 116(5): https://www.webofscience.com/wos/woscc/full-record/WOS:000341178900087.[64] Tian, Feifei, Shang, PanJu, Liu, ZhiQuan. Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint. MATERIALS LETTERS[J]. 2014, 121: 185-187, http://dx.doi.org/10.1016/j.matlet.2014.01.170.[65] Tian, Feifei, Liu, ZhiQuan, Shang, PanJu, Guo, Jingdong. Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2014, 591: 351-355, http://ir.imr.ac.cn/handle/321006/72580.[66] Tian, Feifei, Liu, ZhiQuan. Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2014, 588: 662-667, http://ir.imr.ac.cn/handle/321006/72497.[67] Gao, Shuang, Zhou, Yizhou, Li, CaiFu, Cui, Jingping, Liu, ZhiQuan, Jin, Tao. In situ investigation on the precipitation of topologically close-packed phase in Ni-base single crystal superalloy. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2014, 610: 589-593, http://ir.imr.ac.cn/handle/321006/73229.[68] Gong, Lijun, Chen, Yuxi, Yu, Hongjiang, Liu, Hongbo, Li, Caifu, Liu, ZhiQuan. Carbon-coated Li4Ti5O12 Anode Materials Synthesized Using H2TiO3 as Ti Source. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2014, 30(11): 1092-1095, http://ir.imr.ac.cn/handle/321006/73230.[69] Tian, Feifei, Liu, ZhiQuan, Guo, Jingdong. Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging. JOURNAL OF APPLIED PHYSICS[J]. 2014, 115(4): http://ir.imr.ac.cn/handle/321006/72579.[70] Wang, Fei, Shi, Ruijuan, Liu, ZhiQuan, Shang, PanJu, Pang, Xueyong, Shen, Shuai, Feng, Zhaochi, Li, Can, Shen, Wenjie. Highly Efficient Dehydrogenation of Primary Aliphatic Alcohols Catalyzed by Cu Nanoparticles Dispersed on Rod-Shaped La2O2CO3. ACS CATALYSIS[J]. 2013, 3(5): 890-894, [71] Li, CaiFu, Liu, ZhiQuan, Shang, JianKu. The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2013, 550: 231-238, http://ir.imr.ac.cn/handle/321006/71308.[72] Li, C F, Liu, Z Q. Fabrication of nanocrystalline SnO2 using electron stimulated oxidation. NANOTECHNOLOGY[J]. 2013, 24(20): http://ir.imr.ac.cn/handle/321006/71306.[73] Shang, Z G, Liu, Z Q, Shang, P J, Shang, J K. Synthesis of Single-Crystal TiO2 Nanowire Using Titanium Monoxide Powder by Thermal Evaporation. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2012, 28(5): 385-390, http://lib.cqvip.com/Qikan/Article/Detail?id=42035706.[74] Shang, Z G, Liu, Z Q, Li, Q, Wang, Z J, Shang, J K. Characterization and visible light germicidal efficacy of nitrogen doped TiO2 film crystallized by microwave irradiations. THIN SOLID FILMS[J]. 2012, 520(7): 2429-2433, http://dx.doi.org/10.1016/j.tsf.2011.09.080.[75] Yao ChunFa, Li CaiFu, Liu ZhiQuan, Shang JianKu. Structural Ordering and Magnetic Property of Complex Perovskite Solid Solution (1-x)Pb(Fe2/3W1/3)O-3-xPb(Mg1/2W1/2)O-3. JOURNAL OF INORGANIC MATERIALS[J]. 2011, 26(6): 649-654, https://www.webofscience.com/wos/woscc/full-record/WOS:000292534400015.[76] Li, C F, Liu, Z Q, Shang, P J, Shang, J K. In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy. SCRIPTA MATERIALIA[J]. 2011, 65(12): 1049-1052, http://www.irgrid.ac.cn/handle/1471x/409542.[77] Pang, X Y, Liu, Z Q, Wang, S Q, Shang, J K. Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface. MICROELECTRONICS RELIABILITY[J]. 2011, 51(12): 2330-2335, http://dx.doi.org/10.1016/j.microrel.2011.04.012.[78] Chen, Y X, He, L H, Shang, P J, Tang, Q L, Liu, Z Q, Liu, H B, Zhou, L P. Micro-sized and Nano-sized Fe3O4 Particles as Anode Materials for Lithium-ion Batteries. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY[J]. 2011, 27(1): 41-45, http://lib.cqvip.com/Qikan/Article/Detail?id=36794094.[79] Shang, P J, Liu, Z Q, Li, D X, Shang, J K. Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging. PHILOSOPHICAL MAGAZINE LETTERS[J]. 2011, 91(6): 410-417, http://ir.imr.ac.cn/handle/321006/30642.[80] Yao, C F, Liu, Z Q, Shang, J K. A promising sol-gel route to suppress pyrochlore phase during the synthesis of multiferroic Pb(Fe2/3W1/3)O-3 using inorganic salts. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2010, 502(2): 429-433, http://www.irgrid.ac.cn/handle/1471x/410744.[81] X.Y. Pang, Z.Q. Liu, S.Q. Wang, J.K. Shang. First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010). 材料科学技术学报:英文版[J]. 2010, 1057-1062, http://lib.cqvip.com/Qikan/Article/Detail?id=36469290.[82] Xie, Xiaowei, Shang, Panju, Liu, Zhiquan, Lv, Yongge, Li, Yong, Shen, Wenjie. Synthesis of Nanorod-Shaped Cobalt Hydroxycarbonate and Oxide with the Mediation of Ethylene Glycol. JOURNALOFPHYSICALCHEMISTRYC[J]. 2010, 114(5): 2116-2123, http://www.irgrid.ac.cn/handle/1471x/410694.[83] Pang, X Y, Shang, P J, Wang, S Q, Liu, Z Q, Shang, J K. Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities. JOURNAL OF ELECTRONIC MATERIALS[J]. 2010, 39(8): 1277-1282, http://www.irgrid.ac.cn/handle/1471x/410501.[84] Daghfal, John P, Shang, P J, Liu, Z Q, Shang, J K. Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings. JOURNAL OF ELECTRONIC MATERIALS[J]. 2009, 38(12): 2506-2515, http://www.irgrid.ac.cn/handle/1471x/410956.[85] Shang, P J, Liu, Z Q, Pang, X Y, Li, D X, Shang, J K. Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates. ACTA MATERIALIA[J]. 2009, 57(16): 4697-4706, http://www.irgrid.ac.cn/handle/1471x/411356.[86] Shang, P J, Liu, Z Q, Li, D X, Shang, J K. TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface. JOURNAL OF ELECTRONIC MATERIALS[J]. 2009, 38(12): 2579-2584, http://www.irgrid.ac.cn/handle/1471x/411355.[87] Yang, Qiliang, Shang, Panju, Guo, Jing D, Liu, Zhiquan, Shang, JianKu. Current-induced growth of P-rich phase at electroless nickel/Sn interface. JOURNAL OF MATERIALS RESEARCH[J]. 2009, 24(9): 2767-2774, http://www.irgrid.ac.cn/handle/1471x/411587.[88] Shang, P J, Liu, Z Q, Li, D X, Shang, J K. Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu. SCRIPTA MATERIALIA[J]. 2008, 59(3): 317-320, http://www.irgrid.ac.cn/handle/1471x/412160.[89] Pang, X Y, Wang, S Q, Zhang, L, Liu, ZQ, Shang, J K. First principles calculation of elastic and lattice constants of orthorhombic Cu3Sn crystal. JOURNAL OF ALLOYS AND COMPOUNDS[J]. 2008, 466(1-2): 517-520, http://www.irgrid.ac.cn/handle/1471x/412141.[90] Shang, P J, Liu, Z Q, Li, D X, Shang, J K. Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints. SCRIPTA MATERIALIA[J]. 2008, 58(5): 409-412, http://www.irgrid.ac.cn/handle/1471x/412161.[91] Liu, ZhiQuan, Mitsuishi, Kazutaka, Furuya, Kazuo. Fabrication and investigation of tungsten deposit on top and bottom surfaces of thin film substrate. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS[J]. 2007, 46(9B): 6254-6257, http://ir.imr.ac.cn/handle/321006/33728.