Synthesis, property and reliability of advanced interconnection materials: 1) Electrodeposition of metal film and its application in electronic packaging as UBM, RDL, Pillar, TSV etc; 2) Interfacial reaction of solder joint, IMC growth and transformation, voids formation, elemental diffusion and segregation; 3) Failure analysis and reliability of interconnection materials under thermal, mechanical and electrical fields.

July 1993, B. Sc., Jilin University of Technology, Changchun,China.

July 1996, M.Sc., Dalian Railway Institute, Dalian,China.

Apr. 2000, Ph.D., Dalian Maritime University, Dalian, China.

Sep.2000-Jun.2002, Postdoctoral Research Associate, Okayama University of Science, Okayama, Japan.

Jul.2002-Mar.2007, Research Fellow, National Institute for Materials Science (NIMS), Tsukuba, Japan.

Dec.2006-Mar. 2019, Professor, Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS), Shenyang, China

Nov.2013-Jan.2014, Visiting Professor, Osaka University, Osaka, Japan

Mar.2017-Mar.2018, Guest Professor, Osaka University, Osaka, Japan

Mar. 2019-Present, Professor, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen, China

​Transmission electron microscopy and its application in materials science

Authored and co-authored more than 160 international peer-reviewed journal papers, which were published in Nature, Science, Physical Review Letters, Nanotechnology, Acta Materialia, etc. The total citation of these papers was up to 4500 times at the middle of 2021 in the Web of Science/Google Scholar. The representative publications are listed below:

1. Z.Q. Liu*, H. Hashimoto, E. Sukedai, M. Song, K. Mitsuishi, K. Furuya, In situ observation of the formation of Fe₃O₄  in Fe₄N (001) due to electron irradiation, Phys. Rev. Lett., 2003, 90:255504.

2. Z.Q. Liu*, H. Hashimoto, M. Song, K. Mitsuishi, K. Furuya, Phase transformation from Fe₄N to Fe₃O₄ due to electron irradiation in the transmission electron microscope, Acta Mater., 2004, 52:1669.

3. Z.Q. Liu*, K. Mitsuishi, K. Furuya, A dynamic Monte Carlo study of the in situ growth of a substance deposited using electron-beam-induced deposition, Nanotechnology, 2006, 17:3832.

4. W. Zhang, Z.Q. Liu*, K. Furuya, Fabrication and characterization of cellular iron nanocrystalline film, Nanotechnology, 2008, 19:135302.

5. P.J. Shang, Z.Q. Liu*, X.Y. Pang, D.X. Li, J.K. Shang, Growth mechanism of Cu₃Sn on polycrystalline and single crystal Cu substrates, Acta Mater., 2009, 57:4697.

6. C.F. Li, Z.Q. Liu*, Microstructure and growth mechanism of tin whisker on RESn₃ compounds, Acta Mater., 2013, 61:589.

7. S. Gao, Z.Q. Liu*, C.F. Li, Y.Z. Zhou, T. Jin, In situ TEM investigation on the precipitation behavior of m phase in Ni-base single crystal superalloys, Acta Mater., 2016, 110:268-275.

8. J. Yuan, Z.Q. Liu*, Flexible and self-assembly anistropic FeCo nanochain-polymer composite films for highly stretchable magnetic device, Compos. Sci. Technol., 2018, 164:8-16

9. X.W. Xie, Y. Li, Z.Q. Liu, M. Haruta, W.J. Shen*, Low-temperature oxidation of CO catalyzed by Co₃O₄ nanorods, Nature, 2009, 458:746.

10. H.H. Liu, S. Schmidt, H.F. Poulsen, A. Godfrey, Z.Q. Liu, J. Sharon, X. Huang*, Three-dimensional orientation mapping in the transmission electron microscopy, Science, 2011, 332(6031):833.

Electronic packaging, Metal interconnection materials, Electroplating, Interfacial reaction, Microstructure, Reliability 

1. 2012 Innovation Award, Microscopy Society of America

2. 2014 ICEPT Outstanding Paper Award, ICEPT Organization Committee